Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LPC1112FHN33/102,5 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Mfg Application Notes | LPC111x,13xx Appl Note | |
Product Training Modules | Code Density for LPC11xx | |
Design Resources | Development Tool Selector | |
Standard Package | 260 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | LPC1100L | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-M0 | |
Core Size | 32-Bit | |
Speed | 50MHz | |
Connectivity | I²C, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, POR, WDT | |
Number of I/O | 28 | |
Program Memory Size | 16KB (16K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 2K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
Data Converters | A/D 8x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 32-VQFN Exposed Pad | |
Supplier Device Package | 32-HVQFN (7x7) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LPC1112FHN33/102,5 | |
Related Links | LPC1112FH, LPC1112FHN33/102,5 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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