Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC17S200AVOG8C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | XC17S00A OTP Configuration PROMs 24/Jun/2013 | |
Standard Package | 98 | |
Category | Integrated Circuits (ICs) | |
Family | Memory - Configuration Proms for FPGA's | |
Series | - | |
Packaging | Tube | |
Programmable Type | OTP | |
Memory Size | 2Mb | |
Voltage - Supply | 3 V ~ 3.6 V | |
Operating Temperature | 0°C ~ 70°C | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-TSOP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC17S200AVOG8C | |
Related Links | XC17S20, XC17S200AVOG8C Datasheet, Xilinx Distributor |
BF2M-M | MARKER TIE 18LB NAT 8.3" | datasheet.pdf | ||
50006-XX053 | 3 ROW VERTICAL HDR.PRESS FIT | datasheet.pdf | ||
M27C4001-90C6 | IC OTP 4MBIT 90NS 32PLCC | datasheet.pdf | ||
RNC55K2552FSB14 | RES 25.5K OHM 1/8W 1% AXIAL | datasheet.pdf | ||
316-83-129-41-002101 | Connector Socket 29 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | ||
0151670859 | FFC 1 TYPE A 17 CKTS LGT 76 | datasheet.pdf | ||
ATS-13G-13-C1-R0 | HEATSINK 50X50X15MM XCUT | datasheet.pdf | ||
4MA212500Z3BACUGI8 | OSC MEMS | datasheet.pdf | ||
MBB02070C3400FC100 | RES 340 OHM 0.6W 1% AXIAL | datasheet.pdf | ||
MMB02070C2702FB200 | RES SMD 27K OHM 1% 1W 0207 | datasheet.pdf | ||
CTVS07RF-25-4HE | CTV 143C 48#20 8#16 PIN J/N RE | datasheet.pdf | ||
TVPS00RF-17-26JA | TV 26C 26#20 SKT RECP | datasheet.pdf |