NVIDIA has introduced an AI foundry service to supercharge the development and tuning of custom generative AI applications for enterprises and startups deploying on Microsoft Azure.
This article was posted on Nov 23, 2023Synopsys and Microsoft have developed Synopsys.ai Copilot which designs ICs for the Azure Open AI Service.
This article was posted on Nov 23, 2023Congatec has introduced COM Express Type 6 modules with Raptor Lake (13th generation) Intel Core processors, intended for rugged use over -40 to +85°C.
This article was posted on Nov 22, 2023Silicon Labs has built a family of 8bit microcontrollers around its 8051-based CIP-51 core, running at 50MHz.
This article was posted on Nov 22, 2023The UK Space Agency (UKSA) has announced funding research for the refuelling an upcoming mission to remove space junk. The aim, for sustainability, is to help prolong the life of satellites and prevent adding more debris to the space environment.
This article was posted on Nov 22, 2023Sales of electronics products, ICs and front-end manufacturing equipment are moving upwards, while the market for back-end manufacturing equipment remains weak, says SEMI.
This article was posted on Nov 22, 2023Siemens Digital Industries Software’s PAVE360-based design software for automotive digital twin is now available on AWS.
This article was posted on Nov 22, 2023The advanced IC substrate market is expected to grow at an 11% CAGR from $15 billion in 2022 to nearly $34 billion in 2028, says Yole Developpement.
This article was posted on Nov 22, 2023Infineon had calendar Q3 (fiscal Q4) revenue of €4.149 billion for a profit of €1.044 billion at a margin of 25.2% with free cash flow of €614 million.
This article was posted on Nov 22, 2023Littelfuse has introduced an optically isolated photovoltaic gate driver for mosfets and IGBTs.
This article was posted on Nov 22, 2023Diodes has released a 2.5Gbit/s MIPI D-PHY 1.2 compliant signal repeater for high pixel-count cameras.
This article was posted on Nov 22, 2023The building sector needs to modernise the communications infrastructure to meet net zero CO2 emission goals, urges Meghan Kaiserman.
This article was posted on Nov 22, 2023Pickering Electronics will introduce a series of surface-mount >1kV reed relays at Productronica in Munich next week.
This article was posted on Nov 20, 2023The Andøya Spaceport in Norway has officially opened, readying itself to be the future launch site – for small and medium sized satellites – of Isar Aerospace and its Spectrum rocket.
This article was posted on Nov 20, 2023Synaptics is sampling an integrated single-chip Wi-Fi6E and Bluetooth 5.3.
This article was posted on Nov 20, 2023Surplus components inventory has been a curse all year and will continue into Q4, says Sourcengine in its Q4 Lead Time Report.
This article was posted on Nov 20, 2023A letter to Arm shareholders, signed by the CEO and CFO, reports on Arm’s calendar Q3 (fiscal Q2) performance – the first quarter since it returned to the public equity market.
This article was posted on Nov 20, 2023UCLA researchers have made an electrically-controlled solid-state ‘transistor’ for thermal energy, with a heat-flow on-off ratio of >13:1 when controlled with a ±2.5V base bias at room temperature.
This article was posted on Nov 20, 2023Nisshinbo Micro Devices of Tokyo has launched the NB7142 and NB7143 series Li-Ion battery protection ICs.
This article was posted on Nov 20, 2023The ESA has signalled its intent to foster commercial competition to deliver space cargo return services, following the ESA Space Summit in Seville.
This article was posted on Nov 20, 2023Columbia University researchers have published a paper clsiming Re6Se8Cl2 to be the fastest and most efficient semiconductor material known to man.
This article was posted on Nov 20, 2023