Dialog and  TDK are integrating Dialog’s GreenPAK technology with TDK’s µPOL power devices to create, they claim, the world’s first single-integrated system power sequencing device.

Traditional discrete solutions currently available on the market require an extensive array of components, which reduces board space availability, impacts system reliability and drives up manufacturing costs.

Combining Dialog’s scalable, flexible GreenPAK technology with TDK‘s small, high-density power module solution reduces the number of required components and ensures a more compact, reliable, robust solution for powering advanced industrial embedded control, IoT and 5G applications.

Dialog’s GreenPAK technology reduces production lead time to just four-to-six weeks, supporting high volume fulfillment and expediting the development of complex system boards.

The µPOL product leverages advanced technology packaging techniques such as semiconductor embedded in substrate (SESUB), for cohesive 3D system integration in a smaller size and lower profile.

This integration allows TDK to deliver higher power density and ease of use at a lower total system cost compared to what is currently available today. For example, TDK’s FS1406 6A power module can deliver 15 Watts in a 3.3mm x 3.3mm x 1.5mm height power module, 4-times higher current density than that of the closest competitor.

“Our µPOL micro embedded DC/DC converter enables miniaturization and drives power density alongside Dialog’s compact power sequencer, bringing ease of use and lower total cost of ownership to our customers,” says TDK’s Parviz.