Imec and Park Systems, the Atomic Force Microscopy and Metrology specialist, have signed the 2nd Joint Development Project (JDP) within 4 years to increase the development efforts for future generation in-line AFM metrology solutions.

Dr. Luc Van den hove (President & CEO, Imec) and Dr. Sang-il Park (Chairman & CEO, Park Systems)

he official signing ceremony has taken place last Monday, February 17, 2020, at imec’s headquarters in Leuven, Belgium.

The new JDP extends the collaboration to explore new frontiers of AFM metrology solutions for the wafer semiconductor sector.

As enhanced possibilities of inline automated AFM in semiconductor research, such as surface roughness, critical dimension (CD) and sidewall roughness, have been successfully explored in the first JDP, the second JDP targets multiple strategic developments to address the current metrological challenges of continuously downscaling the geometrical dimensions of devices and 3D assembly stacking.