Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-A3P250-1VQ100 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ProASIC3 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 36864 | |
Number of I/O | 68 | |
Number of Gates | 250000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 70°C | |
Package / Case | 100-TQFP | |
Supplier Device Package | 100-VQFP (14x14) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | A3P250-1VQ100 | |
Related Links | A3P250, A3P250-1VQ100 Datasheet, Microsemi SoC Distributor |
B57862S282F40 | THERMISTOR NTC 2.8K OHM 1% RAD | datasheet.pdf | ||
1N6288ARL4G | TVS DIODE 43.6VWM 70.1VC AXIAL | datasheet.pdf | ||
CCM02-1NO-35ROHS T20 | CONN SMART CARD PUSH-PULL R/A | datasheet.pdf | ||
GCC36DCSD | CONN EDGECARD 72POS DIP .100 SLD | datasheet.pdf | ||
RSMF2FT619R | RES METAL OX 2W 619 OHM 1% AXL | datasheet.pdf | ||
0468001.NRHF | FUSE BOARD MNT 1A 63VAC/VDC 1206 | datasheet.pdf | ||
UCD1A330MCL1GS | CAP ALUM 33UF 20% 10V SMD | datasheet.pdf | ||
ATS-06F-169-C2-R0 | HEATSINK 30X30X10MM R-TAB T766 | datasheet.pdf | ||
ATS-16H-04-C2-R0 | HEATSINK 40X40X20MM XCUT T766 | datasheet.pdf | ||
BFC238560472 | CAP FILM 0.0047 UF 5 % 2KVDC RAD | datasheet.pdf | ||
MKP1845368204 | CAP FILM 68NF 5% 2000VDC AXIAL | datasheet.pdf | ||
D38999/20JG11PD-LC | CONN HSG RCPT FLANGE 11POS PIN | datasheet.pdf |