40V mosfet half-bridge in 3.3 x 3.3mm

Vishay has introduced a 40V n-channel mosfet half-bridge for synchronous buck converters and motor drives with low on-resistance and gate charge.

This article was posted on Oct 26, 2020

Yokogawa gets ISO17025:2017 up to 100kHz for European power calibration lab

Yokogawa’s European Calibration Laboratory in the Netherlands has achieved ISO 17025:2017 accreditation for power measurements at up to 100kHz – ISO/IEC 17025:2017 is the ‘General requirements for the competence of testing and calibration laboratories’.

This article was posted on Oct 26, 2020

ST buys SOMOS Semiconductor

ST has bought the assets of SOMOS Semiconductor of Marly-le-Roy (France) which specialises in silicon-based power amplifiers and in RF Front-End Modules (FEM) products.

This article was posted on Oct 26, 2020

Inclusiveness OBE calls women and girls to enter engineering

Engineer Dr Carol Marsh received an OBE in the Queen’s 2020 birthday honours for services to diversity and inclusion, and is using the platform to further encourage girls and women across the UK to consider engineering careers.

This article was posted on Oct 26, 2020

GloFo leverages Adaptive Body Bias for IoT and wearables

GlobalFoundries is accelerating innovation in the IoT and wearables markets with the specialised Adaptive Body Bias (ABB) feature of its industry-leading 22FDX platform.

This article was posted on Oct 26, 2020

Nokia to use Qualcomm chipsets in small-cell deployments

Nokia will use Qualcomm chipsets for small cells in its indoor Smart Node 5G All-in-One base stations expected to be available in Q1 2021.

This article was posted on Oct 26, 2020

2020 wafer shipments to grow 2.4%

Wafer shipments will grow 2.4% y-o-y in 2020, with growth continuing in 2021 and shipments reaching a record high in 2022, says SEMI.

This article was posted on Oct 26, 2020

Synopsys launches on-chip analytics IP

Synopsys has introduced its Silicon Lifecycle Management (SLM) platform – a data-analytics-driven approach to optimizing SoCs from the design phase through to end-user deployment.

This article was posted on Oct 26, 2020

SIA and SRC publish $3.4bn plan for stimulating US semiconductor R&D

The SIA and the Semiconductor Research Corporation (SRC) have released a preview of their upcoming “Decadal Plan for Semiconductors,” a report outlining chip research and funding priorities over the next decade that will help strengthen U.S. semiconductor technology and spur growth in emerging technologies such as artificial intelligence, quantum computing, advanced wireless communications.

This article was posted on Oct 26, 2020

Metal conductors sintered onto skin at room temperature

Metal conductors can be formed directly onto human skin, according to an international science team which found a way to sinter silver nano-particles into silver conductors at room temperature.

This article was posted on Oct 26, 2020

MIPI A-PHY to get IEEE standard

The MIPI Alliance has signed a memorandum of understanding with the IEEE to adopt the MIPI A-PHY specification as an IEEE standard – A-PHY only became available to MIPI members in September.

This article was posted on Oct 23, 2020

CEA mass-spectrometry breakthrough

Targeting analysis of biological particles with large aspect ratios, such as viruses or fibrils, CEA scientists have demonstrated a breakthrough in single-particle mass spectrometry (MS) that could fast track the detection of viral particles in hospitals, offices, airplanes and other public places.

This article was posted on Oct 23, 2020

64MP image sensor has 1micron pixel size

OmniVision is sampling a 64MP resolution image sensor with the largest pixel size in its class, at 1.0 micron, along with an optical format of 1/1.34.

This article was posted on Oct 23, 2020

Astroscale raises $191m in funding for space debris removal

The Japanses company Astroscale Holdings – which specialises in space debris removal – has announced it has closed its Series E round with additional funding of $51 million, bringing the total investment raised to $191 million.

This article was posted on Oct 23, 2020

IEEE initiative to accelerate standards process

The IEEE Standards Association (IEEE SA) has announced the Industry Affiliate Network (IAN), an initiative designed to assist multistakeholder industry organizations in accelerating development and adoption of global standards.

This article was posted on Oct 23, 2020

China to take 22% of foundry market this year

China’s share of the pure-play foundry market is forecast to be 22% in 2020, 17 percentage points greater than it registered in 2010 (Figure 1).

This article was posted on Oct 23, 2020

Fujitsu collaborates to make practical quantum computing a reality

Fujitsu has joined with Riken and the universities of Tokyo, Osaka and Delft to make practical quantum computing a reality.

This article was posted on Oct 23, 2020

micro:bit version 2 : educational computer now runs AI and gets a loudspeaker

Details have been announced of version 2 of the BBC micro:bit educational computer.

This article was posted on Oct 23, 2020

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This article was posted on Oct 23, 2020

Zortrax 3D prints super-tough conductive polymer for space

Supported by the European Space Agency, Polish 3D printer company Zortrax has developed a way to co-print two forms of the super-tough polymer PEEK – one insulating and one conductive.

This article was posted on Oct 23, 2020

Imec shows interconnects for 2nm processes

Imec has demonstrated, for the first time, electrically functional 2-metal-level interconnects fabricated with Ru semi-damascene and airgap technology showing a long lifetime and good mechanical strength.

This article was posted on Oct 21, 2020