650V CoolMOS for auto market

Infineon has added to its CoolMOS family to support the electro-mobility market.

This article was posted on May 25, 2020

Capacitors endure 150°C for 1000 hours

Panasonic have introduced a surface-mount type ZF series of Conductive Polymer Hybrid Aluminum Electrolytic Capacitors.

This article was posted on May 25, 2020

Q2 phone units to be down 16.5%

Q2 smartphone production will be down 16.5% y-o-y at 287 million units, says TrendForce.

This article was posted on May 25, 2020

Flat Apple

For calendar Q1 (FY Q2) Apple had $58.3 billion revenues for a net profit of $11.2 billion compared to revenue of $58.0 billion and a net profit of $11.6 billion in calendar Q1 2019.

This article was posted on May 25, 2020

Nanotube’s cut thermal resistance of heatsink interface

Fujitsu Laboratories has created a thin flexible adhesive sheet thermal interface material for heatsinking that achieves up to 100W/mK thermal conductivity.

This article was posted on May 25, 2020

MicroEJ has standard virtualisation tech for Microchip MCUs

MicroEJ has available standard virtualization technology for Microchip Technology’s 32-bit MCU product line.

This article was posted on May 25, 2020

NASA selects Human Landing Systems for 2024 lunar visit

NASA has announced its initial choice of three companies – Blue Origin, Dynetics and SpaceX – to design and develop human landing systems for the Artemis moon landing programme.

This article was posted on May 25, 2020

Raspberry Pi upgrades camera module with Sony IMX477R sensor

The Raspberry Pi Foundation has updated the camera module for the Pi: The Raspberry Pi High Quality Camera module.

This article was posted on May 25, 2020

800G MACsec engine

Rambus has announced an 800G MACsec (Media Access Control security) offering for next-generation networking infrastructure.

This article was posted on May 25, 2020

STM32Cube software now on GitHub

ST is publishing STM32Cube embedded software on GitHub.

This article was posted on May 25, 2020

Qualcomm revenues up 7% y-o-y

For calendar Q1 (FY Q2) Qualcomm had revenues of $5.2 billion up 7% y-o-y.

This article was posted on May 19, 2020

5-9% 2020 foundry growth

The foundry market will grow at 5-9% this year with a median of 6.8% forecasts TrendForce.

This article was posted on May 19, 2020

HiSilicon beats Qualcomm in China AP market

HiSilicon, the IC design arm of Huawei, has overtaken Qualcomm in the China domestic smartphone AP market, according to CINNO Research, a China analyst.

This article was posted on May 19, 2020

RetroPie 4.6 launched with beta support for Raspberry Pi 4

RetroPie 4.6 has been launched with official support for Raspberry Pi 4.

This article was posted on May 19, 2020

Microsoft Q1 up 15% – unaffected by virus

Announcing Q1 revenues up 15% y-o-y for a net profit up 22% y-o-y of $10.8 billion, Microsoft said: “COVID-19 had minimal net impact on the total company revenue.”

This article was posted on May 19, 2020

Keysight’s LoadCore 5G Core software qualifies network performance

Keysight Technologies has announced LoadCore 5G Core (5GC) Testing software, which simulates complex subscriber models.

This article was posted on May 19, 2020

ISSCC 2020: RC oscillator hits 6.15ppm/°C

After delving into Texas Instrument’s crystal-replacing bulk acoustic wave (BAW) oscillator recently, Electronics Weekly is taking a look at an advanced version of the humble RC oscillator, reported at the International Solid State Circuits Conference earlier this year (ISSCC 2020).

This article was posted on May 19, 2020

COM Express Type 6 module with AMD Ryzen

Congatec has announced a COM Express Type 6 module with AMD Ryzen Embedded V1404I Series processors for use across -40°C to +85°C.

This article was posted on May 19, 2020

Picocom licenses CEVA for small cell chip

Picocom has licensed and deployed the CEVA-XC12 DSP in its forthcoming distributed unit (DU) baseband offload System-on-Chip (SoC) for 5G small cells.

This article was posted on May 19, 2020

Insight SiP signs TME

Insight SiP, the developer of miniature RF modules with embedded antennas, using SiP and Antenna-in-Package technology, has signed an international distribution agreement with TME of Lódź.

This article was posted on May 19, 2020

Memory market peak of 2018 will not be reached again till 2022

The memory market will not reach its 2018 high of $163 billion until 2022, says IC Insights, with strong growth forecast to return to the market in 2021 (21%) and 2022 (29%).

This article was posted on May 18, 2020