Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-ATS-09D-124-C2-R0 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Video File | How to Install Push Pin Heat Sinks | |
Design Resources | pushPIN™ Selector Tool | |
Featured Product | ATS - pushPIN™ Heat-sinks | |
Standard Package | 1 | |
Category | Fans, Thermal Management | |
Family | Thermal - Heat Sinks | |
Series | pushPIN™ | |
Type | Top Mount | |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
Attachment Method | Push Pin | |
Shape | Square, Fins | |
Length | 1.969" (50.00mm) | |
Width | 1.969" (50.00mm) | |
Diameter | - | |
Height Off Base (Height of Fin) | 0.984" (25.00mm) | |
Power Dissipation @ Temperature Rise | - | |
Thermal Resistance @ Forced Air Flow | 3.18°C/W @ 100 LFM | |
Thermal Resistance @ Natural | - | |
Material | Aluminum | |
Material Finish | Blue Anodized | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | ATS-09D-124-C2-R0 | |
Related Links | ATS-09D-, ATS-09D-124-C2-R0 Datasheet, Advanced Thermal Solutions Inc. Distributor |
HBLXT9860AHC.B4 | IC REDRIVER ETHERNET 8CH 2080QFP | datasheet.pdf | ||
MIC2211-GMBML-TR | IC REG LDO 1.8V/2.8V 10MLF | datasheet.pdf | ||
S456-003 | CABLE SCSI ULTRA2 VHDCI68M/M 3' | datasheet.pdf | ||
4814P-1-470 | RES ARRAY 7 RES 47 OHM 14SOIC | datasheet.pdf | ||
VI-B5K-CX-F1 | CONVERTER MOD DC/DC 40V 75W | datasheet.pdf | ||
ELM 7-530 | LED MT SR VERT X 0.530" 3MM 2LD | datasheet.pdf | ||
RWR81S4220FSBSL | RES 422 OHM 1W 1% WW AXIAL | datasheet.pdf | ||
ATS-18E-177-C2-R0 | HEATSINK 35X35X20MM R-TAB T766 | datasheet.pdf | ||
RSE112063 | LOW PROFILE, 3 POLE/25 AMP, WC | datasheet.pdf | ||
MDM-25SH047F-A174 | MICRO 25C S 6" WHT FLOAT NI | datasheet.pdf | ||
5223016-5 | FB-5R,ASY,150,SIG,HDR,EN,4.25 | datasheet.pdf | ||
XC2C64-4VQ44C | This lends power savings to High-end Communication equipment and speed to battery operated devices. IC | datasheet.pdf |