Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-BM10NB(0.6)-30DS-0.4V(75) | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Video File | Tablet PC Connectors - Hirose Connectors for the Smart House - Hirose | |
Standard Package | 8,000 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
Series | BM10 | |
Packaging | Tape & Reel (TR) | |
Connector Type | Receptacle, Center Strip Contacts | |
Number of Positions | 30 | |
Pitch | 0.016" (0.40mm) | |
Number of Rows | 2 | |
Mounting Type | Surface Mount | |
Features | Solder Retention | |
Contact Finish | Gold | |
Contact Finish Thickness | 3.9µin (0.10µm) | |
Mated Stacking Heights | 0.6mm | |
Height Above Board | 0.023" (0.60mm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | BM10NB(0.6)-30DS-0.4V(75) | |
Related Links | BM10NB(0.6)-, BM10NB(0.6)-30DS-0.4V(75) Datasheet, Hirose Electric Co Ltd Distributor |
9C12063A15R4FKHFT | RES SMD 15.4 OHM 1% 1/4W 1206 | datasheet.pdf | ||
UPW2V100MHH | CAP ALUM 10UF 20% 350V RADIAL | datasheet.pdf | ||
ERJ-S08F17R4V | RES SMD 17.4 OHM 1% 1/4W 1206 | datasheet.pdf | ||
MAX3093EESE+T | IC RS485/422 RX 10MBPS 16-SOIC | datasheet.pdf | ||
EVAL-AD7152EBZ | BOARD EVAL AD7152 | datasheet.pdf | ||
DPC-230-20B46 | XFRMR LAMINATED 4.4VA THRU HOLE | datasheet.pdf | ||
TC-10.000MBE-T | OSC MEMS 10.000MHZ CMOS SMD | datasheet.pdf | ||
RLR05C1500FPBSL | RES 150 OHM 1% 1/8W AXIAL | datasheet.pdf | ||
RN55D2501FRE6 | RES 2.5K OHM 1/8W 1% AXIAL | datasheet.pdf | ||
GRM1885C2A150GA01D | CAP CER 15PF 100V NP0 0603 | datasheet.pdf | ||
SIT9002AC-08H18EQ | OSC MEMS PROG | datasheet.pdf | ||
500D305F150CB5A | 3UF 150V 8X17.5 85C AXI | datasheet.pdf |