Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S060TS-FGG676 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 60K Logic Modules | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 387 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S060TS-FGG676 | |
Related Links | M2S060T, M2S060TS-FGG676 Datasheet, Microsemi SoC Distributor |
H3ABT-10108-N8 | JUMPER-H1506TR/A3048N/H1504TR 8" | datasheet.pdf | ||
142-10-422-00-592000 | HEADER OPEN .018"DIA .400 22POS | datasheet.pdf | ||
HP-HOLDDOWN-CLIP | ACCY HOLD-DOWN CLIP FOR HP RELAY | datasheet.pdf | ||
39133 | LID PLASTEK 19-3/8X15-3/4X2 | datasheet.pdf | ||
PZU4.7B3,115 | DIODE ZENER 4.7V 310MW SOD323F | datasheet.pdf | ||
BLM18RK102SN1D | FERRITE CHIP 1000 OHM 200MA 0603 | datasheet.pdf | ||
2009R1C2.75W | FUSE M/V R-RATED 9R 2.75KV HOOKE | datasheet.pdf | ||
OSTYK51522330 | Connector Barrier Block Strip 22 Circuit 0.374" (9.50mm) | datasheet.pdf | ||
AAC06FSLD | CONN EDGE ADAPT CARD-CARD 12POS | datasheet.pdf | ||
VE-27J-MX-F1 | CONVERTER MOD DC/DC 36V 75W | datasheet.pdf | ||
VHK100W-Q48-S24-DIN | DC/DC CONVERTER 24V 100W | datasheet.pdf | ||
76644-108 | RELIMATE TERMINAL TIN | datasheet.pdf |