Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCP6472T-E/MNY | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Mold Compound Update 18/Feb/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
PCN Other | CuPdAu Bond Wire 24/Apr/2015 | |
Standard Package | 3,300 | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Series | - | |
Packaging | Tape & Reel (TR) | |
Amplifier Type | General Purpose | |
Number of Circuits | 2 | |
Output Type | Rail-to-Rail | |
Slew Rate | 1.1 V/µs | |
Gain Bandwidth Product | 2MHz | |
-3db Bandwidth | - | |
Current - Input Bias | 1pA | |
Voltage - Input Offset | 1.5mV | |
Current - Supply | 100µA | |
Current - Output / Channel | 32mA | |
Voltage - Supply, Single/Dual (±) | 2 V ~ 5.5 V, ±1 V ~ 2.75 V | |
Operating Temperature | -40°C ~ 125°C | |
Mounting Type | Surface Mount | |
Package / Case | 8-WFDFN Exposed Pad | |
Supplier Device Package | 8-TDFN (2x3) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCP6472T-E/MNY | |
Related Links | MCP6472, MCP6472T-E/MNY Datasheet, Microchip Technology Distributor |
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