NXP Semiconductors/Freescale Semiconductor, Inc. MK26FN2M0VMI18
- Mfg. Part Number
- MK26FN2M0VMI18
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 32BIT 2MB FLASH 169BGA
- Datasheet Download
- MK26FN2M0VMI18.pdf
Availability of MK26FN2M0VMI18
Available Quantity
5800 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 10.09200
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of MK26FN2M0VMI18, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MK26FN2M0VMI18 can be shipped within 24 hours after order. If you have any demands for MK26FN2M0VMI18, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- MK26FN2M0VMI18 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
MK26FN2M0VMI18
| Internal Part Number | EIS-MK26FN2M0VMI18 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 260 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Kinetis K20 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M4 | |
| Core Size | 32-Bit | |
| Speed | 180MHz | |
| Connectivity | CAN, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | |
| Peripherals | DMA, I²S, LVD, POR, PWM, WDT | |
| Number of I/O | 116 | |
| Program Memory Size | 2MB (2M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 256K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
| Data Converters | A/D 2x16b, D/A 2x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 169-LFBGA | |
| Supplier Device Package | 169-MAPBGA (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MK26FN2M0VMI18 | |
| Related Links | MK26FN2, MK26FN2M0VMI18 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
MK26FN2M0VMI18 Details Description
Related parts for MK26FN2M0VMI18
 | NJG1105F-TE1 | IC MMIC AMP 1.8/1.9/2.1GHZ MTP6 | datasheet.pdf | |
 | THJB685M016RJN | CAP TANT 6.8UF 16V 20% 1210 | datasheet.pdf | |
 | P51-300-G-F-M12-4.5OVP-000-000 | SENSOR 300PSI 1/4-18NPT .5-4.5V | datasheet.pdf | |
| TLK-225 | SUREGRIP MASTER ACCESSORY SET | datasheet.pdf | |
 | TSC2046EIPWG4 | IC TOUCH SCREEN 12BIT 16TSSOP | datasheet.pdf | |
| MS3126E10-6SW | CONN PLUG 6POS STRAIGHT W/SCKT | datasheet.pdf | |
| 1-172051-0 | 10P MTEI RCPT HSG ASY 22 | datasheet.pdf | |
 | DMA564070R | TRANS PREBIAS DUAL PNP SMINI6 | datasheet.pdf | |
| VI-B7N-IY-F4 | CONVERTER MOD DC/DC 18.5V 50W | datasheet.pdf | |
| HWM2424U11BK | 24U 11IN SWING OUT WALL MOUNT | datasheet.pdf | |
| ATS-16G-73-C3-R0 | HEATSINK 25X25X10MM R-TAB T412 | datasheet.pdf | |
| ATS-03A-34-C3-R0 | HEATSINK 57.9X36.83X22.86MM T412 | datasheet.pdf |