Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MKL26Z32VFT4 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | KINETIS K, L, COLDFIRE+ Errata Update 17/Oct/2013 Datasheet Update 23/Oct/2014 | |
PCN Assembly/Origin | Assembly Site Expansion 23/Jan/2015 Assembly Site Revision A 26/Feb/2015 | |
PCN Packaging | QFN 7x7x1.0mm Tray Change 04/Nov/2013 | |
Standard Package | 260 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | Kinetis KL2 | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-M0+ | |
Core Size | 32-Bit | |
Speed | 48MHz | |
Connectivity | I²C, LIN, SPI, UART/USART, USB, USB OTG | |
Peripherals | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | |
Number of I/O | 36 | |
Program Memory Size | 32KB (32K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 4K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
Data Converters | A/D - 16bit, D/A - 12bit | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 105°C | |
Package / Case | 48-VFQFN Exposed Pad | |
Supplier Device Package | 48-QFN (7x7) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MKL26Z32VFT4 | |
Related Links | MKL26Z, MKL26Z32VFT4 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
ECJ-2YC2D151J | CAP CER 150PF 200V NP0 0805 | datasheet.pdf | ||
110-13-422-41-001000 | CONN IC DIP SOCKET 22POS GOLD | datasheet.pdf | ||
1672250000 | TERM BLOCK PLUG 10POS 5.08MM | datasheet.pdf | ||
KAS1112ET | SW DIP SLIDE SPST 12 POS SEALED | datasheet.pdf | ||
MAX8667ETEHR+T | IC REG QD BCK/LINEAR SYNC 16TQFN | datasheet.pdf | ||
8N3SV76BC-0114CDI | IC OSC VCXO 300MHZ 6-CLCC | datasheet.pdf | ||
ATS-18H-183-C3-R0 | HEATSINK 40X40X20MM R-TAB T412 | datasheet.pdf | ||
ATS-21C-33-C2-R0 | HEATSINK 57.9X36.83X17.78MM T766 | datasheet.pdf | ||
Z16F28UB100KITG | KIT USB DESIGN BOARD MINI-Z | datasheet.pdf | ||
F339MX241031JFP2B0 | CAP FILM 0.1UF 5% 310VAC AXIAL | datasheet.pdf | ||
TM27CB-EH01 | MARKING LABEL HORIZONTAL 1 TO 50 | datasheet.pdf | ||
MAL215611223E3 | 22000UF 50V 35X60MM 85C 5000H | datasheet.pdf |