Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-TSW-141-26-G-S | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Board-to-Board Connectors | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Male Pins | |
Series | TSW | |
Packaging | Bulk | |
Contact Type | Male Pin | |
Connector Type | Header, Unshrouded | |
Number of Positions | 41 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 1 | |
Row Spacing | - | |
Contact Mating Length | 0.230" (5.84mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Fastening Type | - | |
Features | - | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | TSW-141-26-G-S | |
Related Links | TSW-141, TSW-141-26-G-S Datasheet, Samtec, Inc. Distributor |
MCR18EZPJ4R3 | RES SMD 4.3 OHM 5% 1/4W 1206 | datasheet.pdf | ||
Z8F0430QJ020SG | IC ENCORE XP MCU FLASH 4K 28QFN | datasheet.pdf | ||
RG2012P-1130-B-T5 | RES SMD 113 OHM 0.1% 1/8W 0805 | datasheet.pdf | ||
EBA50DTAN | CONN EDGECARD 100PS R/A .125 SLD | datasheet.pdf | ||
DAC7513N/250G4 | IC 12-BIT R-R D/A CONV SOT23-8 | datasheet.pdf | ||
VJ1825Y393JBEAT4X | CAP CER 0.039UF 500V X7R 1825 | datasheet.pdf | ||
SN74ACT563DBRG4 | IC D-TYPE LATCH SGL 3-ST 20SSOP | datasheet.pdf | ||
MS27508E18B35PB | CONN RCPT 66POS BOX MNT W/PINS | datasheet.pdf | ||
SC312MF-680 | FIXED IND 68UH 210MA 4.1 OHM SMD | datasheet.pdf | ||
77313-118-00LF | BERGSTRIP | datasheet.pdf | ||
54201-G0804ALF | CONN HEADER | datasheet.pdf | ||
SIT3807AC-C-25SG | OSC MEMS PROG 2.5V SMD | datasheet.pdf |