Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC3SD1800A-4FGG676C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Extended Spartan 3A FPGA Family | |
PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 Copper Wire Bond Material 09/Dec/2013 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Spartan®-3A DSP | |
Number of LABs/CLBs | 4160 | |
Number of Logic Elements/Cells | 37440 | |
Total RAM Bits | 1548288 | |
Number of I/O | 519 | |
Number of Gates | 1800000 | |
Voltage - Supply | 1.14 V ~ 1.26 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC3SD1800A-4FGG676C | |
Related Links | XC3SD1800, XC3SD1800A-4FGG676C Datasheet, Xilinx Distributor |
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