Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-0011326878 | |
| Lead Free Status / RoHS Status | Lead free by exemption / RoHS compliant by exemption | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Uncategorized | |
| Family | Miscellaneous | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 0011326878 | |
| Related Links | 00113, 0011326878 Datasheet, Molex Connector Corporation Distributor | |
![]() | ADR425ARZ | IC VREF SERIES 5V 8SOIC | datasheet.pdf | |
![]() | PIC16LC622-04/P | IC MCU 8BIT 3.5KB OTP 18DIP | datasheet.pdf | |
![]() | 641653-3 | CONN RECEPT 3POS 22AWG MTA100 | datasheet.pdf | |
![]() | EBM10DTKI | CONN EDGECARD 20POS DIP .156 SLD | datasheet.pdf | |
![]() | TNPW12101M00BETA | RES SMD 1M OHM 0.1% 1/3W 1210 | datasheet.pdf | |
![]() | S-8244AAEFN-CEET2G | IC LI-ION BATT PROTECT 8-MSOP | datasheet.pdf | |
![]() | CD74HC08QM96G4Q1 | IC GATE AND 4CH 2-INP 14-SOIC | datasheet.pdf | |
![]() | RNC55H2230BSBSL | RES 223 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | M55342E06B3B16RTI | RES SMD 3.16KOHM 0.1% 0.15W 0805 | datasheet.pdf | |
![]() | 7789227020 | PAC-S300-SD15 CBL ASSY | datasheet.pdf | |
![]() | FLK-TI100/C1A 9HZ | GENERAL PURPOSE THERMAL IMAGER 9 | datasheet.pdf | |
![]() | FI-JH30S-HF10-R3000 | CONN WIRE TO BOARD 0.4MM 30POS | datasheet.pdf |