Xilinx Acquires Assets of Falcon Computing Solutions to Advance Software Programmability and Expand Developer Community

Falcon Computing’s innovative compiler technology makes it easier for software developers to create custom high-performance accelerated applications using FPGAs and adaptive SoCs SAN JOSE, Calif.--(BUSINESS WIRE)-- Xilinx, Inc. (NASDAQ: XLNX) today announced it has acquired Falcon Computing Solutions, a privately-held leading provider of high-level synthesis (HLS) compiler optimization technology for hardware acceleration of software applications. The acquisition will make adaptive computing more accessible to software developers by enhancing the Xilinx Vitis™ Unified Software Platform with automated hardware-aware optimizations.

This article was posted on Dec 28, 2020

Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions

SAN JOSE, Calif.--(BUSINESS WIRE)-- Xilinx, Inc. (NASDAQ: XLNX) today announced a collaboration with Texas Instruments (TI) to develop scalable and adaptable digital front-end (DFE) solutions to increase energy efficiency of lower antenna count radios. The solutions leverage Xilinx's adaptable IP to enhance the RF performance and improve the power efficiency of indoor and outdoor radio applications. By combining Xilinx's industry-leading Zynq UltraScale+ MPSoC family and adaptable RF IP with the AFE7769 quad-channel RF transceiver from TI, developers can better address the OPEX and CAPEX concerns of large operators and private networks.

This article was posted on Dec 28, 2020

Xilinx and Samsung Deliver Industry’s First Adaptable Computational Storage Drives

Fully customizable and scalable SmartSSD computational storage platform moves compute closer to storage for accelerated data processing speed and efficiency

This article was posted on Dec 28, 2020

Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments

New class of adaptive radio platforms combines flexibility for evolving 5G standards and a hardened radio digital front-end for performance, power, and cost effectiveness

This article was posted on Dec 28, 2020

AMD to Acquire Xilinx, Creating the Industry’s High Performance Computing Leader

Strategic transaction strengthens AMD’s industry-leading technology portfolio

This article was posted on Dec 28, 2020

Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS

Adaptive model enables medical equipment makers and healthcare service providers to rapidly develop trained models for clinical and radiological applications

This article was posted on Dec 28, 2020

Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar for Autonomous Driving

SAN JOSE, Calif. & HANNOVER, Germany--(BUSINESS WIRE)-- Xilinx, Inc. (NASDAQ: XLNX) and Continental today announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq® UltraScale+™ MPSoC platform, creating the automotive industry’s first production-ready 4D imaging radar. The collaboration enables newly-produced vehicles equipped with the ARS540 to realize SAE J3016 Level 2 functionalities and will pave the way toward Level 5 autonomous driving systems.

This article was posted on Dec 28, 2020

Xilinx Joins the Open RAN Policy Coalition

Demonstrates commitment to 5G wireless market growth with broad technology portfolio to enable deployment of open networks across multi-vendor ecosystems

This article was posted on Dec 28, 2020

Subaru Selects Xilinx to Power New-Generation EyeSight System New ADAS technology debuts in the all-new Subaru Levorg for the Japanese market

New ADAS technology debuts in the all-new Subaru Levorg for the Japanese market

This article was posted on Dec 28, 2020

Xilinx to Present at the Deutsche Bank 2020 Technology Conference

SAN JOSE, Calif.--(BUSINESS WIRE)-- Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, announced that Brice Hill, executive vice president and chief financial officer, will participate in a virtual fireside chat at the Deutsche Bank 2020 Technology Conference.

This article was posted on Dec 28, 2020

Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Markets

T1 Telco Accelerator Card delivers increased network performance while dramatically reducing CPU core count, cost, and power, enabling a simplified, efficient 5G virtualized infrastructure

This article was posted on Dec 28, 2020

Mosfets for motor drives up to 48V

Rohm is aiming at motor drives operating on 24, 36 or 48V with n-channel mosfets rated at 40, 60, 100 or 150V to give some leeway for spikes and noise.

This article was posted on Jun 8, 2023

3mm microphones for wearables and portables

CUI has three new micromachined omnidirectional microphones for portable devices and wearables, that can work across 20 to 20,000 Hz.

This article was posted on Jun 8, 2023

Kioxia sampling UFS 4.0

Kioxia is sampling UFS Ver. 4.0 embedded flash memories which integrate BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package.

This article was posted on Jun 8, 2023

Shunt resistors with a wide temperature range

TT Electronics has announced a series of shunt resistors for high current measurements in the hundreds of amps range.

This article was posted on Jun 8, 2023

UK hosts inaugural AUKUS AI and autonomy trial

The UK has hosted the first AUKUS AI and autonomy trial, with the aim of driving artificial intelligence into military use.

This article was posted on Jun 8, 2023

IBM and ASMPT develop better chiplet bond

The new hybrid bonding method has the potential to increase the data throughput between chiplets, and the number of chiplets that could be installed in a given space, leading to a chiplet system that would act more like a single SOC.

This article was posted on Jun 8, 2023

X-Fab offers 110nm BCD-on-SoI process

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so.

This article was posted on Jun 8, 2023

RISC-V Summit: Customisable vector unit

Semidynamics has announced a customisable vector unit for RISC-V processor cores, compliant with RISC-V vector specification 1.0.

This article was posted on Jun 8, 2023

Fuji joins 3d printed electronics alliance

Fuji Corporation has joined 3d printed electronics association JAMES (Jetted Additively Manufactured Electronics Sources), which describes itself as establishing a collaborative community that brings together professionals and enthusiasts from various fields to drive additive manufacturing development in 3D printed electronics.

This article was posted on Jun 8, 2023

NASA’s snake robot is propelled by screws

Pondering movement over a wide range of terrains and through complex 3d worlds, NASA’s Jet Propulsion Laboratory has come up with a snake-like robot called Eels – for Exobiology extant life surveyor.

This article was posted on Jun 8, 2023