Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-0078005615N01753 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 10 | |
| Category | RF/IF and RFID | |
| Family | RFI and EMI - Shielding and Absorbing Materials | |
| Series | - | |
| Shape | - | |
| Thickness - Overall | 0.11" (2.8mm) | |
| Width | 0.32" (8.1mm) | |
| Length | * | |
| Adhesive | - | |
| Temperature Range | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 0078005615N01753 | |
| Related Links | 00780056, 0078005615N01753 Datasheet, Laird Technologies EMI Distributor | |
![]() | MRS25000C3320FRP00 | RES 332 OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | RMM06DRST-S664 | CONN EDGECARD 12POS DIP .156 SLD | datasheet.pdf | |
![]() | ND06T00104K-- | THERMISTOR NTC 100K OHM 10% DISC | datasheet.pdf | |
![]() | DS33ZH11+ | IC MAPPER ETHERNET 100CSBGA | datasheet.pdf | |
![]() | WD2FE02GX818-667G-HE | MODULE DDR2-667 2GB 240-FBDIMM | datasheet.pdf | |
![]() | LM3S5C56-IQR80-A1T | IC MCU 32BIT 512KB FLASH 64LQFP | datasheet.pdf | |
![]() | 456-450 | MNTG PAD NYL | datasheet.pdf | |
![]() | RN55E1242DRE6 | RES 12.4K OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | LTR10EZPF1R00 | RES SMD 1 OHM 1/4W 0805 WIDE | datasheet.pdf | |
![]() | 316-83-113-41-003101 | Connector Socket 13 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 0452005.MRSN | FUSE BOARD MOUNT 5A 125VAC 2SMD | datasheet.pdf | |
![]() | TVP00RF-17-73PD | HD 38999 73C 73#23 PIN RECP | datasheet.pdf |