Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-08-036-105 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cable Assemblies | |
| Family | Rectangular Cable Assemblies | |
| Series | 105 | |
| Connector Type | DIP to DIP, Reversed | |
| Number of Positions | 8 | |
| Number of Rows | 2 | |
| Pitch - Connector | 0.100" (2.54mm) | |
| Pitch - Cable | 0.050" (1.27mm) | |
| Length | 3.00' (914.40mm) | |
| Features | - | |
| Color | Multiple, Ribbon | |
| Shielding | Unshielded | |
| Usage | - | |
| Cable Termination | Solder | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 10µin (0.25µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 08-036-105 | |
| Related Links | 08-03, 08-036-105 Datasheet, Aries Electronics, Inc. Distributor | |
![]() | M3DFK-1618R | IDC CABLE - MKR16K/MC16M/MCF16K | datasheet.pdf | |
![]() | MCR18EZHF2873 | RES SMD 287K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | PIC18F4450-I/ML | IC MCU 8BIT 16KB FLASH 44QFN | datasheet.pdf | |
![]() | GCM11DRYF | CONN EDGECARD 22POS DIP .156 SLD | datasheet.pdf | |
![]() | WW2JB3R30 | RES 3.3 OHM 1.5W 5% AXIAL | datasheet.pdf | |
![]() | EP2AGX125EF35C6N | IC FPGA 452 I/O 1152FBGA | datasheet.pdf | |
![]() | DSPIC33EP32GP502-H/MM | IC DSC 16BIT 32KB FLASH 28QFN | datasheet.pdf | |
![]() | 1641-473H | FIXED IND 47UH 200MA 2.11 OHM TH | datasheet.pdf | |
![]() | 9405-36 | FIXED IND 100UH 198MA 5.5 OHM TH | datasheet.pdf | |
![]() | BACC63BV16F10P7 | 26500 10C 10#16 P TH RECP WC | datasheet.pdf | |
![]() | AD8572ARU | Zero-Drift, Single-Supply, Rail-to-Rail Input/Output Operational Amplifiers IC | datasheet.pdf | |
![]() | XC4020XLA-3BG256C | IC FPGA 160 I/O 208QFP | datasheet.pdf |