Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-0997-0-50-20-75-14-11-0 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 500 | |
| Category | Connectors, Interconnects | |
| Family | Contacts, Spring Loaded and Pressure | |
| Series | 0997 | |
| Material | Brass Alloy | |
| Plating | Gold | |
| Plating - Thickness | 20µin (0.51µm) | |
| Mounting Type | Surface Mount | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 0997-0-50-20-75-14-11-0 | |
| Related Links | 0997-0-50-2, 0997-0-50-20-75-14-11-0 Datasheet, Mill-Max Distributor | |
![]() | BK/MDL-V-2-1/2 | FUSE GLASS 2.5A 250VAC 3AB 3AG | datasheet.pdf | |
![]() | 3AP 1 | FUSE GLASS 1A 250VAC 3AB 3AG | datasheet.pdf | |
| 848-AG10D | CONN IC DIP SOCKET 48POS GOLD | datasheet.pdf | ||
![]() | ACPM-7392-BLK | IC PA MOD UMTS BAND4 10-SMD | datasheet.pdf | |
![]() | VI-B3R-EY-B1 | CONVERTER MOD DC/DC 7.5V 50W | datasheet.pdf | |
![]() | DS34T104GN | IC TDM/PACKET CHIP 484-BGA | datasheet.pdf | |
![]() | 13-0518-11H | CONN SOCKET SIP 13POS GOLD | datasheet.pdf | |
![]() | ATS-02F-125-C3-R0 | HEATSINK 54X54X10MM XCUT T412 | datasheet.pdf | |
![]() | ATS-17A-90-C1-R0 | HEATSINK 35X35X35MM R-TAB | datasheet.pdf | |
![]() | T38067-01-0 | Connector Barrier Block Strip 1 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | 767141104GPTR13 | RES ARRAY 13 RES 100K OHM 14SOIC | datasheet.pdf | |
![]() | LJT00RE25-61S-SR | LJT 61C 61#20 SKT RECP | datasheet.pdf |