Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-10-0625-70 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Headers, Specialty Pin | |
| Series | 0625 | |
| Packaging | Bulk | |
| Connector Type | Header Strip | |
| Contact Type | Post | |
| Number of Positions | 10 | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 1 | |
| Row Spacing | - | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Features | - | |
| Contact Finish | Tin | |
| Contact Finish Thickness | 200µin (5.08µm) | |
| Color | Black | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 10-0625-70 | |
| Related Links | 10-06, 10-0625-70 Datasheet, Aries Electronics, Inc. Distributor | |
![]() | MC33275DT-2.5RK | IC REG LDO 2.5V 0.3A DPAK | datasheet.pdf | |
![]() | ERJ-S1TF7872U | RES SMD 78.7K OHM 1% 1W 2512 | datasheet.pdf | |
![]() | MC14060BFELG | IC COUNTER/OSC 14BT BIN 16SOEIAJ | datasheet.pdf | |
![]() | RL6115 | BOX ABS GRAY 3.15"L X 2.36"W | datasheet.pdf | |
![]() | 0TLN030.T | FUSE FAST/A TELE-GARD 30A 170VDC | datasheet.pdf | |
![]() | B41550E4109Q | CAP ALUM 10000UF 16V SCREW | datasheet.pdf | |
| EFM32ZG210F32-QFN32T | IC MCU 32BIT 32K FLASH 32QFN | datasheet.pdf | ||
![]() | ATS-18C-81-C1-R0 | HEATSINK 30X30X20MM R-TAB | datasheet.pdf | |
![]() | ATS-11D-103-C1-R1 | HEATSINK 40X40X9.5MM XCUT | datasheet.pdf | |
![]() | 91911-4 | PREMIUM SDE DIE, COAXICON | datasheet.pdf | |
![]() | DAC8840GBC | 8-Bit Octal, 4-Quadrant Multiplying, CMOS TrimDAC IC | datasheet.pdf | |
![]() | XC3S1600E-FG400 | IC FPGA 250 I/O 320FBGA | datasheet.pdf |