Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-100-028-051 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | SMSK Series 26/Jun/2008 | |
Standard Package | 200 | |
Category | Connectors, Interconnects | |
Family | Sockets for ICs, Transistors | |
Series | 100 | |
Packaging | Bulk | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Number of Positions or Pins (Grid) | 28 (2 x 14) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 8µin (0.20µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame, Seal Tape | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | Flash | |
Contact Material - Post | Brass | |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
Operating Temperature | -65°C ~ 125°C | |
Termination Post Length | 0.126" (3.20mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 100-028-051 | |
Related Links | 100-0, 100-028-051 Datasheet, 3M Distributor |
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