Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-10005639-11114 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | I-O Connections Product Portfolio | |
| PCN Design/Specification | DDR II, FBDIMM Housing Standoff 27/Mar/2007 | |
| PCN Assembly/Origin | DDRII, DDR II Site Transfer 26/Apr/2007 Memory Connectors 27/Sept/2010 | |
| PCN Packaging | Multiple Devices 24/Jul/2015 | |
| Standard Package | 2,688 | |
| Category | Connectors, Interconnects | |
| Family | Memory Connectors - Inline Module Sockets | |
| Series | 10005639 | |
| Packaging | Tray | |
| Connector Style | DIMM | |
| Number of Positions | 240 | |
| Memory Type | DDR2 SDRAM | |
| Standards | MO-237 | |
| Mounting Type | Through Hole | |
| Features | Board Lock, Latches | |
| Mounting Feature | Normal, Standard - Top | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 3µin (0.08µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 10005639-11114 | |
| Related Links | 1000563, 10005639-11114 Datasheet, FFF Distributor | |
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