Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-10069525-204602LF | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | BTB Design 21/Feb/2014 | |
Standard Package | 400 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
Series | BergStak®, MezzSelect™ | |
Packaging | Tape & Reel (TR) | |
Connector Type | Plug, Center Strip Contacts | |
Number of Positions | 200 | |
Pitch | 0.031" (0.80mm) | |
Number of Rows | 2 | |
Mounting Type | Surface Mount | |
Features | Board Guide | |
Contact Finish | Gold | |
Contact Finish Thickness | Flash | |
Mated Stacking Heights | 8mm, 12mm, 16mm | |
Height Above Board | 0.303" (7.70mm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 10069525-204602LF | |
Related Links | 10069525, 10069525-204602LF Datasheet, FFF Distributor |
MJE5851 | TRANS PNP 350V 8A TO220AB | datasheet.pdf | ||
4116R-2-684LF | RES ARRAY 15 RES 680K OHM 16DIP | datasheet.pdf | ||
LSP3RXXX | LIGHT ENG ARRAY 3X1W RED 48MM | datasheet.pdf | ||
222D953-4/42-0 | BOOT MOLDED | datasheet.pdf | ||
LFXP15C-3F484I | IC FPGA 300 I/O 484BGA | datasheet.pdf | ||
CTB2X1BGA-C | TIE MOUNT FOAM ADHESIVE | datasheet.pdf | ||
CA02COME22-14SWB | CONN RCPT 19POS BOX MNT W/SKTS | datasheet.pdf | ||
APG6-24431-6 | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | ||
811-S1-054-10-017101 | CONN SPRING LOAD 54POS SNGL PCB | datasheet.pdf | ||
AP105-GT1-1P-2428/1.6C(71 | TOOL APPLICATOR GT1 ACCESSORY | datasheet.pdf | ||
A40430804 | CONN BARRIER STRIP 8CIRC .562 | datasheet.pdf | ||
97-3106B28-16PX-417-940 | AB 20C 20#16 PIN PLUG | datasheet.pdf |