Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-10M25DCF484I7G | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | MAX® 10 | |
Number of LABs/CLBs | 1563 | |
Number of Logic Elements/Cells | 25000 | |
Total RAM Bits | 691200 | |
Number of I/O | 360 | |
Number of Gates | - | |
Voltage - Supply | 1.15 V ~ 1.25 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 10M25DCF484I7G | |
Related Links | 10M25DC, 10M25DCF484I7G Datasheet, Alt Distributor |
![]() | 9T08052A28R7CBHFT | RES SMD 28.7 OHM 0.25% 1/8W 0805 | datasheet.pdf | |
![]() | ECM08DTBT | CONN EDGECARD 16POS R/A .156 SLD | datasheet.pdf | |
![]() | MAX4397SACTM+T | IC SW A/V SCART CON 48-TQFN | datasheet.pdf | |
![]() | EXB-V4V160JV | RES ARRAY 2 RES 16 OHM 0606 | datasheet.pdf | |
![]() | SP3495EEN-L | IC TXRX RS485/RS422 ESD 8NSOIC | datasheet.pdf | |
![]() | RNC55J17R8BSBSL | RES 17.8 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RN55E2552FBSL | RES 25.5K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | B82725S2253N40 | RING CORE DBL CHOKE 1.0MH 25A | datasheet.pdf | |
![]() | PM75CL1B060 | MOD IPM 6-PAC L1 75A 600V | datasheet.pdf | |
![]() | 926781-01-31-I | CONN HEADER 31POS .100" GOLD | datasheet.pdf | |
![]() | 10116781-007210LF | 0.8MM WTB CABLE CONN | datasheet.pdf | |
![]() | HM04608000J0G | 1016 TB SP CL DIP SOLDER | datasheet.pdf |