Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-1116722-1 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 500 | |
Category | Connectors, Interconnects | |
Family | D-Sub, D-Shaped Connectors - Accessories | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 1116722-1 | |
Related Links | 1116, 1116722-1 Datasheet, TE Connectivity AMP Connectors Distributor |
![]() | CM309S10.240MABJT | Crystal 10.2400MHz 30ppm 18pF 50 Ohm -10°C - 60°C Surface Mount 4-SOJ, 9.40mm pitch | datasheet.pdf | |
![]() | 5220.0143.3 | MOD PWR INLET MED FILTER 1A PNL | datasheet.pdf | |
![]() | NCP1835MN20R2G | IC BATT CHRGR LI-ION 4.2V 10-DFN | datasheet.pdf | |
![]() | P51-750-S-P-I12-4.5OVP-000-000 | SENSOR 750PSI M20-1.5 6G .5-4.5V | datasheet.pdf | |
![]() | BUK654R0-75C,127 | MOSFET N-CH 75V 120A TO220AB | datasheet.pdf | |
![]() | RNCF0402DTE105R | RES SMD 105 OHM 0.5% 1/16W 0402 | datasheet.pdf | |
![]() | B43252B337M | CAP ALUM 330UF 20% 315V SNAP | datasheet.pdf | |
![]() | CMF559K0900FERE70 | RES 9.09K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | ATS-10G-11-C3-R0 | HEATSINK 50X50X10MM XCUT T412 | datasheet.pdf | |
![]() | BGA924N6E6327XTSA1 | IC AMP SI-MMIC | datasheet.pdf | |
![]() | XL212-256-FB236-I20 | IC MCU 256KB RAM 236FBGA | datasheet.pdf | |
![]() | 495893 | 2:1 HEAT SHRINK TRANSPARENT | datasheet.pdf |