Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-2-641605-2 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
RoHS Information | 2-641605-2 Statement of Compliance | |
PCN Obsolescence/ EOL | Socket product 01/Jul/2014 | |
Standard Package | 1,500 | |
Category | Connectors, Interconnects | |
Family | Sockets for ICs, Transistors | |
Series | Diplomate DL | |
Packaging | Tube | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Number of Positions or Pins (Grid) | 28 (2 x 14) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Open Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Thermoplastic, Glass Filled | |
Operating Temperature | -55°C ~ 125°C | |
Termination Post Length | 0.128" (3.24mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | - | |
Contact Resistance | 30 mOhm | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 2-641605-2 | |
Related Links | 2-641, 2-641605-2 Datasheet, TE Connectivity AMP Connectors Distributor |
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