3M 216-6278-00-3303
- Mfg. Part Number
- 216-6278-00-3303
- Manufacturer
- 3M
- Product Category
- Sockets for ICs, Transistors
- Brief Description
- CONN IC DIP SOCKET ZIF 16POS GLD
- Datasheet Download
- 216-6278-00-3303.pdf
Availability of 216-6278-00-3303
Available Quantity
5149 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 6.82500
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of 216-6278-00-3303, we specialize in 3M all series electronic components. 216-6278-00-3303 can be shipped within 24 hours after order. If you have any demands for 216-6278-00-3303, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- 216-6278-00-3303 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
216-6278-00-3303
| Internal Part Number | EIS-216-6278-00-3303 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| MSDS Material Safety Datasheet | Burn-In Sockets(Mtl #033) MSDS | |
| Featured Product | 3M™ ZIP DIP Sockets | |
| Standard Package | 100 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | OEM | |
| Packaging | Bulk | |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
| Number of Positions or Pins (Grid) | 16 (2 x 8) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 250µin (6.35µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | 250µin (6.35µm) | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polyether Imide (PEI), Glass Filled | |
| Operating Temperature | -55°C ~ 105°C | |
| Termination Post Length | 0.110" (2.78mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 1A | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 216-6278-00-3303 | |
| Related Links | 216-6278, 216-6278-00-3303 Datasheet, 3M Distributor | |
216-6278-00-3303 Details Description
Related parts for 216-6278-00-3303
 | 9T08052A3482FBHFT | RES SMD 34.8K OHM 1% 1/8W 0805 | datasheet.pdf | |
 | 5227726-3 | CONN BNC JACK STR 50 OHM SOLDER | datasheet.pdf | |
| RBC40DRTN | CONN EDGECARD 80POS DIP .100 SLD | datasheet.pdf | |
| EBC36DRYH-S13 | CONN EDGECARD 72POS .100 EXTEND | datasheet.pdf | |
| 0479005.MXEP | FUSE GLASS 5A 600VAC 2AG | datasheet.pdf | |
 | GRM0337U1H3R7CD01D | CAP CER 3.7PF 50V U2J 0201 | datasheet.pdf | |
| VE-BNL-IU-F2 | CONVERTER MOD DC/DC 28V 200W | datasheet.pdf | |
 | RN55C1262DB14 | RES 12.6K OHM 1/8W .5% AXIAL | datasheet.pdf | |
| RER70F3R16PCSL | RES CHAS MNT 3.16 OHM 1% 20W | datasheet.pdf | |
 | 5SGXEA5K3F35I3N | IC FPGA 432 I/O 1152FBGA | datasheet.pdf | |
| SCE048MD2DD1B | BUZZER PIEZO 42.9MM PANEL MOUNT | datasheet.pdf | |
| CTV07RF-15-55PA-P35AD | HD 38999 55C 55#23 PIN RECP | datasheet.pdf |