Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-23LCV1024-I/P | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tube | |
| Format - Memory | RAM | |
| Memory Type | NVSRAM (Non-Volatile SRAM) | |
| Memory Size | 1M (128K x 8) | |
| Speed | 20MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.5 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 8-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 8-DIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 23LCV1024-I/P | |
| Related Links | 23LCV1, 23LCV1024-I/P Datasheet, Microchip Technology Distributor | |
![]() | STTH8R03D | DIODE GEN PURP 300V 8A TO220AC | datasheet.pdf | |
![]() | EEC25DRXH | CONN EDGECARD 50POS DIP .100 SLD | datasheet.pdf | |
![]() | RN55D6984FB14 | RES 6.98M OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 831-87-028-10-230101 | Connector Socket 28 Position 0.079" (2.00mm) Gold Through Hole | datasheet.pdf | |
![]() | 1004MP | TRANS RF BIPO 7W 300MA 55FW1 | datasheet.pdf | |
![]() | 8N3Q001EG-0021CDI | IC OSC CLOCK QD FREQ 10CLCC | datasheet.pdf | |
![]() | LCC350-14BW-X | LUG COPPER 2 HOLE | datasheet.pdf | |
![]() | ATS-10G-40-C2-R0 | HEATSINK 57.9X60.96X11.43MM T766 | datasheet.pdf | |
![]() | DDMMD24X7PJ | DSUB 24H7 M PCR/A G50 50 OHM | datasheet.pdf | |
![]() | TG205160B0J0G | 508 TB RISING CLAMP 45D | datasheet.pdf | |
![]() | D38999/24ZE26BD | TV 26C 26#20 SKT J/N RECP | datasheet.pdf | |
![]() | TV07RW-23-53A | TV 53C 53#20 PIN J/N RECP | datasheet.pdf |