Aries Electronics, Inc. 24-C300-30

24-C300-30 picture photo
Mfg. Part Number
24-C300-30
Manufacturer
Product Category
Sockets for ICs, Transistors
Brief Description
CONN IC DIP SOCKET 24POS GOLD
Datasheet Download
24-C300-30.pdf
Availability of 24-C300-30

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 13.88857
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of 24-C300-30, we specialize in Aries Electronics, Inc. all series electronic components. 24-C300-30 can be shipped within 24 hours after order. If you have any demands for 24-C300-30, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
24-C300-30 Order Process
Add Parts to RFQ form
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We reply within 24 hours
You confirm order
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Specifications of 24-C300-30
Internal Part NumberEIS-24-C300-30
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Standard Package1
Category Connectors, Interconnects
FamilySockets for ICs, Transistors
SeriesEJECT-A-DIP™
PackagingBulk
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)24 (2 x 12)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
Termination Post Length0.040" (1.02mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)24-C300-30
Related Links24-C3, 24-C300-30 Datasheet, Aries Electronics, Inc. Distributor
24-C300-30 Details Description
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