Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-4318 1/2 X 18 YD | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Date Code Decipher | |
| Standard Package | 18 | |
| Category | Tapes, Adhesives | |
| Family | Tape | |
| Series | 4300 | |
| Packaging | Roll | |
| Tape Type | Single Coated Foam | |
| Adhesive | Acrylic, 430 | |
| Backing, Carrier | Polyurethane Foam | |
| Thickness | 0.250" (250 mils, 6.350mm) 1/4" | |
| Thickness - Adhesive | 0.247" (247 mils, 6.27mm) | |
| Thickness - Backing, Carrier, Liner | 0.0030" (3.0 mils, 0.076mm) | |
| Width | 0.50" (12.70mm) 1/2" | |
| Length | 54' (16.5m) 18 yds | |
| Color | Gray | |
| Usage | Holding, Joining, Mounting | |
| Temperature Range | 150°F (66°C) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 4318 1/2 X 18 YD | |
| Related Links | 4318 1/2, 4318 1/2 X 18 YD Datasheet, 3M Distributor | |
![]() | RG2012V-6040-P-T1 | RES SMD 604 OHM 0.02% 1/8W 0805 | datasheet.pdf | |
![]() | EBM36DTKT-S288 | CONN EDGECARD 72POS .156 EXTEND | datasheet.pdf | |
![]() | IRF8113GPBF | MOSFET N-CH 30V 17.2A 8-SO | datasheet.pdf | |
![]() | TAS5631BDKDR | IC AMP AUD 300W STER D 44HSSOP | datasheet.pdf | |
![]() | VI-261-EV-F2 | CONVERTER MOD DC/DC 12V 150W | datasheet.pdf | |
![]() | N25Q128A13E1240F | IC FLASH 128MBIT 108MHZ 24TBGA | datasheet.pdf | |
![]() | RCB30DYFR | CONN EDGECARD .050" 30POS SMD | datasheet.pdf | |
![]() | 1N6026B | DIODE ZENER 120V 500MW DO35 | datasheet.pdf | |
![]() | MS46SR-30-700-Q1-15X-15R-NC-AP | SYSTEM | datasheet.pdf | |
![]() | 165X13049X | CONN BACKSHELL 37POS | datasheet.pdf | |
![]() | SIT9002AI-08N25ST | OSC MEMS PROG | datasheet.pdf | |
![]() | XC4044XL1HQ240C-0630 | IC FPGA 289 I/O 352MBGA | datasheet.pdf |