Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-496090 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cables, Wires - Management | |
| Family | Heat Shrink Tubing | |
| Series | HST | |
| Type | Tubing, Flexible | |
| Shrinkage Ratio | 3 to 1 | |
| Length | 98.4' (30.0m) | |
| Inner Diameter - Supplied | 1.575" (40.0mm) | |
| Inner Diameter - Recovered | 0.512" (13.0mm) | |
| Recovered Wall Thickness | 0.094" (2.40mm) | |
| Material | Polyolefin (PO), Irradiated | |
| Features | Adhesive Lined, Flame Retardant, UV Resistant | |
| Color | White | |
| Operating Temperature | -55°C ~ 125°C | |
| Shrink Temperature | 80°C | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 496090 | |
| Related Links | 496, 496090 Datasheet, Essentra Components (formerly Richco, Inc.) Distributor | |
![]() | MC34063ADX | IC REG BUCK BOOST INV ADJ 8SOIC | datasheet.pdf | |
![]() | EP4SE820H35I3N | IC FPGA 744 I/O 1152HBGA | datasheet.pdf | |
![]() | TFF11105HN/N1,118 | IC FREQUENCY GEN VSAT 24HVQFN | datasheet.pdf | |
![]() | DAC3162EVM | EVAL MODULE FOR DAC3162 | datasheet.pdf | |
![]() | VI-2NX-MY-F4 | CONVERTER MOD DC/DC 5.2V 50W | datasheet.pdf | |
![]() | VI-B5L-EX-B1 | CONVERTER MOD DC/DC 28V 75W | datasheet.pdf | |
![]() | CMF5510K700BEEB70 | RES 10.7K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | IUGN66-34444-3 | CIRCUIT BREAKER MAG-HYDR TOGGLE | datasheet.pdf | |
| 766163000XP | RES ARRAY 8 RES ZERO OHM 16SOIC | datasheet.pdf | ||
![]() | 0LMF007.H | FUSE INLINE TIME DELAY 300V 7A | datasheet.pdf | |
![]() | EF-DI-VID-MIX-SITE | XILINX IC EF-DI-VID-MIX-SITE In stock | datasheet.pdf |