Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-56-702-003-LI | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 25 | |
| Category | Connectors, Interconnects | |
| Family | D-Sub Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 56-702-003-LI | |
| Related Links | 56-702, 56-702-003-LI Datasheet, API Technologies Corp Distributor | |
![]() | SSF-LXH140HGW | LED T-5MM 695NM RED WHT PCB | datasheet.pdf | |
![]() | THS4150IDGN | IC OPAMP DIFF 340MHZ 8MSOP | datasheet.pdf | |
![]() | MAX4702ETE+T | IC SWITCH QUAD SPDT 16TQFN | datasheet.pdf | |
![]() | CRCW121810R2FKEK | RES SMD 10.2 OHM 1% 1W 1218 | datasheet.pdf | |
![]() | V110B5H150BG3 | CONVERTER MOD DC/DC 5V 150W | datasheet.pdf | |
![]() | RNC55H6550BSB14 | RES 655 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | B82442H1155J | FIXED IND 1.5MH 100MA 16 OHM SMD | datasheet.pdf | |
![]() | CMF55887R00BEBF | RES 887 OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | GMB.00.025.DG | BEND RELIEF 2.5MM GRAY | datasheet.pdf | |
| 501FBG-ADAG | OSC PROG 5NS 30PPM 2X2.5MM | datasheet.pdf | ||
![]() | T38467-23-0 | Connector Barrier Block Strip 23 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | MTCPQKT2P22SGBC | I/O CONN | datasheet.pdf |