Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-667-10ABSP | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Heat Sinks | |
| Series | 667 | |
| Type | Board Level, Vertical | |
| Package Cooled | TO-220 | |
| Attachment Method | Bolt On and PC Pin | |
| Shape | Rectangular, Fins | |
| Length | 0.500" (12.70mm) | |
| Width | 1.375" (34.93mm) | |
| Diameter | - | |
| Height Off Base (Height of Fin) | 1.000" (25.40mm) | |
| Power Dissipation @ Temperature Rise | 6W @ 76°C | |
| Thermal Resistance @ Forced Air Flow | 5.8°C/W @ 200 LFM | |
| Thermal Resistance @ Natural | - | |
| Material | Aluminum | |
| Material Finish | Black Anodized | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 667-10ABSP | |
| Related Links | 667-1, 667-10ABSP Datasheet, Wakefield Distributor | |
![]() | H4BXG-10110-B1 | JUMPER-H9991TR/A3047B/X 10" | datasheet.pdf | |
![]() | MCP603T-E/CH | IC OPAMP GP 2.8MHZ RRO SOT23-6 | datasheet.pdf | |
![]() | 448XD2502BDN | POT SLIDE 5K OHM .2W 30MM | datasheet.pdf | |
![]() | GEM18DRMN | CONN EDGECARD 36POS .156 WW | datasheet.pdf | |
![]() | HMM11DRYS | CONN EDGECARD 22POS DIP .156 SLD | datasheet.pdf | |
![]() | GCM06DCTT-S288 | CONN EDGECARD 12POS .156 EXTEND | datasheet.pdf | |
![]() | ACM15DTAI | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
![]() | PTN1206E94R2BST1 | RES SMD 94.2 OHM 0.1% 0.4W 1206 | datasheet.pdf | |
![]() | I352HL,TGBG | BOX PLSTC GRAY 11.71"L X 10.21"W | datasheet.pdf | |
![]() | VE-J6Y-MW-F2 | CONVERTER MOD DC/DC 3.3V 66W | datasheet.pdf | |
| SI5342C-A-GMR | IC CLK BUFFER PLL 44QFN | datasheet.pdf | ||
![]() | PM-500A33 | DC/DC CONVERTER 3.3V 500MA | datasheet.pdf |