Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-7025S17J8 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 200 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Dual Port, Asynchronous | |
| Memory Size | 128K (8K x 16) | |
| Speed | 17ns | |
| Interface | Parallel | |
| Voltage - Supply | 4.5 V ~ 5.5 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 84-LCC (J-Lead) | |
| Supplier Device Package | 84-PLCC (29.21x29.21) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 7025S17J8 | |
| Related Links | 7025, 7025S17J8 Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | CY2305SXI-1 | IC CLK ZDB 5OUT 133MHZ 8SOIC | datasheet.pdf | |
![]() | FMC28DREI-S734 | CONN EDGECARD 56POS .100 EYELET | datasheet.pdf | |
![]() | 531100B02500G | BOARD LEVEL HEAT SINK | datasheet.pdf | |
![]() | 4N33-X009T | OPTOISO 5.3KV DARL W/BASE 6SMD | datasheet.pdf | |
![]() | 5SGXEA7N2F40I2L | IC FPGA 600 I/O 1517FBGA | datasheet.pdf | |
![]() | HM2P07PCF1M1N9 | MPAC 5R ST PF HDR | datasheet.pdf | |
![]() | GCB120DYRN-S1355 | CONN CARD EXTEND .050" 120POS | datasheet.pdf | |
![]() | 5440059 | TERM BLOCK PLUG | datasheet.pdf | |
![]() | ATS-10C-205-C3-R0 | HEATSINK 60X60X6MM XCUT T412 | datasheet.pdf | |
![]() | DY040-7-1 | AC/DC CONVERTER 12V 45W | datasheet.pdf | |
![]() | IEGH66-1-63-15.0-01-V | CIR BRKR MAG-HYDR LEVER 15A | datasheet.pdf | |
![]() | GTC06CF22-21P | GT 3C 1#0 2#16 PIN PLUG | datasheet.pdf |