Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-7027S55PF | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 12 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Dual Port, Asynchronous | |
| Memory Size | 512K (32K x 16) | |
| Speed | 55ns | |
| Interface | Parallel | |
| Voltage - Supply | 4.5 V ~ 5.5 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 100-LQFP | |
| Supplier Device Package | 100-TQFP (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 7027S55PF | |
| Related Links | 7027, 7027S55PF Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | TMS32C6414DGLZ5E0 | IC DSP FIXED-POINT 532-BGA | datasheet.pdf | |
![]() | 90311-044LF | CONN HOUSING 44POS 2MM W/KEY | datasheet.pdf | |
![]() | EEC36DRAN-S734 | CONN EDGECARD 72POS .100 R/A PCB | datasheet.pdf | |
![]() | AGM18DRSH | CONN EDGECARD 36POS DIP .156 SLD | datasheet.pdf | |
| TLC372CPW | IC DIFF COMP DUAL 8-TSSOP | datasheet.pdf | ||
![]() | CB7JBR750 | RES .75 OHM 7W 5% CERAMIC WW | datasheet.pdf | |
![]() | FDC500018 | OSC XO 125.000MHZ CMOS SMD | datasheet.pdf | |
![]() | B32522C6154J289 | CAP FILM 0.15UF 5% 400VDC RADIAL | datasheet.pdf | |
![]() | KTR03EZPJ181 | RES SMD 180 OHM 5% 1/10W 0603 | datasheet.pdf | |
![]() | ATS-07C-84-C2-R0 | HEATSINK 30X30X35MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-13C-179-C2-R0 | HEATSINK 35X35X30MM R-TAB T766 | datasheet.pdf | |
![]() | AIB6CGMSS2-20-2PC | GT 1C 1#0 PIN PLUG | datasheet.pdf |