Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-70T631S15BF | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 14 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Dual Port, Asynchronous | |
| Memory Size | 4.5M (256K x 18) | |
| Speed | 15ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.4 V ~ 2.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 208-LFBGA | |
| Supplier Device Package | 208-CABGA (15x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 70T631S15BF | |
| Related Links | 70T63, 70T631S15BF Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | ECQ-P1H563GZW | CAP FILM 0.056UF 2% 50VDC RADIAL | datasheet.pdf | |
![]() | 10206 | LAMINATE MICA ESD BEIGE 36X12' | datasheet.pdf | |
![]() | RG1608N-1621-B-T1 | RES SMD 1.62KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 1879281-1 | RES SMD 309K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | 0752352113 | CONN HEADER BACKPLANE 80POS GOLD | datasheet.pdf | |
![]() | VI-JWP-IZ-F1 | CONVERTER MOD DC/DC 13.8V 25W | datasheet.pdf | |
![]() | RNC55J1070FSRSL | RES 107 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | F07008097 | POS TRANS-XDCR JP/2 2.5K/5.0% | datasheet.pdf | |
![]() | CMF554K5000FEBF | RES 4.5K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | 315-87-154-41-001101 | Connector Socket 54 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-11G-10-C3-R0 | HEATSINK 45X45X25MM XCUT T412 | datasheet.pdf | |
![]() | 2148039-3 | C/A, 24F 50/125UM OM2, MPO(F), 3 | datasheet.pdf |