Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-70V7519S166BCI8 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Dual Port, Synchronous | |
| Memory Size | 9M (256K x 36) | |
| Speed | 166MHz | |
| Interface | Parallel | |
| Voltage - Supply | 3.15 V ~ 3.45 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-CABGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 70V7519S166BCI8 | |
| Related Links | 70V7519, 70V7519S166BCI8 Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | 1884597 | CONN BASE CPLNG SIDE ENTRY PG21 | datasheet.pdf | |
![]() | P1597NLT | XFRMR FOR LINEAR TECH CHIPSET | datasheet.pdf | |
![]() | XA6SLX45-2FGG484Q | IC FPGA 316 I/O 484FGGBGA | datasheet.pdf | |
![]() | LKX2E391MESZ40 | CAP ALUM 390UF 20% 250V SNAP | datasheet.pdf | |
![]() | RN55E3321BB14 | RES 3.32K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RN55D5762FRSL | RES 57.6K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | WL1831MODGBMOCT | MODULE WIFI WILINK | datasheet.pdf | |
![]() | ATS-08H-121-C3-R0 | HEATSINK 50X50X10MM XCUT T412 | datasheet.pdf | |
![]() | KJB0T19W32AA | CONN HSG RCPT 32POS WALL MNT PIN | datasheet.pdf | |
![]() | 0638002500 | TPA ACT SYS3 CKT STD PLU | datasheet.pdf | |
![]() | 21030 | FUSE LINK KS 30A RB 23" | datasheet.pdf | |
![]() | XC4036XLA-09BG352AKP | IC FPGA 288 I/O 352MBGA | datasheet.pdf |