Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-74AUP1G332GM,115 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Logic Packages | |
| Featured Product | MicroPak™ | |
| PCN Assembly/Origin | Wafer Fab Site Addition 01/Nov/2014 | |
| PCN Packaging | Date Code Extended 18/Jul/2013 Lighter Reels 02/Jan/2014 | |
| Standard Package | 5,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Logic - Gates and Inverters | |
| Series | 74AUP | |
| Packaging | Tape & Reel (TR) | |
| Logic Type | OR Gate | |
| Number of Circuits | 1 | |
| Number of Inputs | 3 | |
| Features | - | |
| Voltage - Supply | 0.8 V ~ 3.6 V | |
| Current - Quiescent (Max) | 0.5µA | |
| Current - Output High, Low | 4mA, 4mA | |
| Logic Level - Low | 0.7 V ~ 0.9 V | |
| Logic Level - High | 1.6 V ~ 2 V | |
| Max Propagation Delay @ V, Max CL | 5.5ns @ 3.3V, 30pF | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Supplier Device Package | 6-XSON, SOT886 (1.45x1) | |
| Package / Case | 6-XFDFN | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 74AUP1G332GM,115 | |
| Related Links | 74AUP1G3, 74AUP1G332GM,115 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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