Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-802-10-008-10-007000 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 50 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Headers, Specialty Pin | |
| Series | 802 | |
| Packaging | Bulk | |
| Connector Type | Header Strip | |
| Contact Type | Solder Cup | |
| Number of Positions | 8 | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 2 | |
| Row Spacing | 0.100" (2.54mm) | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 10µin (0.25µm) | |
| Color | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 802-10-008-10-007000 | |
| Related Links | 802-10-008, 802-10-008-10-007000 Datasheet, Mill-Max Distributor | |
![]() | LT1117CM-3.3 | IC REG LDO 3.3V 0.8A D2PAK | datasheet.pdf | |
![]() | RG1005P-3320-B-T1 | RES SMD 332 OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | H2F1.38BK25 | 2:1 FAB HEATSHRINK BLK 35MM 25' | datasheet.pdf | |
![]() | SDR1030-331K | FIXED IND 330UH 380MA 1.7 OHM | datasheet.pdf | |
![]() | NCP18WF104J0SRB | THERMISTOR NTC 100K OHM 5% 0603 | datasheet.pdf | |
![]() | ORT8850L-1BMN680I | IC FPGA 278 I/O 680FPBGA | datasheet.pdf | |
![]() | STM32F215RGT6TR | MCU ARM 1024KB FLASH 64LQFP | datasheet.pdf | |
![]() | DJT14E25-61SB-LC | CONN HSG RCPT JAM NUT 61POS SKT | datasheet.pdf | |
![]() | SP02CE-22-55P | CONN RCPT 55POS BOX MNT PIN | datasheet.pdf | |
![]() | NBPDANS005PGUNV | BRD MNT PRESSURE SENSORS | datasheet.pdf | |
![]() | TV07RW-17-35JN-LC | TV 55C 55#22D SKT J/N RECP | datasheet.pdf | |
![]() | 97-3100A16-9PX | AB 4C 2#16, 2#12 PIN RECP | datasheet.pdf |