Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-85-PGM11007-10H | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | PGM | |
| Packaging | Bulk | |
| Type | PGA | |
| Number of Positions or Pins (Grid) | - | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 10µin (0.25µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | - | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Finish Thickness - Post | 200µin (5.08µm) | |
| Contact Material - Post | Brass | |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Operating Temperature | -55°C ~ 105°C | |
| Termination Post Length | 0.165" (4.19mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 3A | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 85-PGM11007-10H | |
| Related Links | 85-PGM1, 85-PGM11007-10H Datasheet, Aries Electronics, Inc. Distributor | |
![]() | 9537640000 | FUSE HOLDER CARTRIDGE 300V 6.3A | datasheet.pdf | |
![]() | PIC16C58B-40/P | IC MCU 8BIT 3KB OTP 18DIP | datasheet.pdf | |
![]() | 181-015-213R531 | D-Sub Connector Receptacle, Female Sockets 15 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | AGM22DTBD-S189 | CONN EDGECARD 44POS R/A .156 SLD | datasheet.pdf | |
![]() | 353379-2 | SQUIB CONN FERRITE | datasheet.pdf | |
![]() | RNC55H1004BRRSL | RES 1M OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RN55C1152BRSL | RES 11.5K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | VN02A00000J0G | 254 TB RIS CLA 180D SOL | datasheet.pdf | |
![]() | ERA-2APB331X | RES SMD 330 OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | 1411094 | G-ESSWU-M32-L66L-NTES-S | datasheet.pdf | |
![]() | 1830485 | IMC 1 5/ 9-G-3 5 P20 THR | datasheet.pdf | |
![]() | XC2V2000-4FG575I | IC FPGA 624 I/O 957FCBGA | datasheet.pdf |