Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-85-PGM11007-10H | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | PGM | |
| Packaging | Bulk | |
| Type | PGA | |
| Number of Positions or Pins (Grid) | - | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 10µin (0.25µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | - | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Finish Thickness - Post | 200µin (5.08µm) | |
| Contact Material - Post | Brass | |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Operating Temperature | -55°C ~ 105°C | |
| Termination Post Length | 0.165" (4.19mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 3A | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 85-PGM11007-10H | |
| Related Links | 85-PGM1, 85-PGM11007-10H Datasheet, Aries Electronics, Inc. Distributor | |
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