Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-852-10827 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Networking Solutions | |
| Family | Media Converters | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 852-10827 | |
| Related Links | 852-, 852-10827 Datasheet, B&B Electronics Distributor | |
![]() | MIC5021BN | IC DRIVER MOSFET HI SIDE HS 8DIP | datasheet.pdf | |
![]() | H0PPS-1406M | DIP CABLE - HDP14S/AE14M/HDP14S | datasheet.pdf | |
![]() | TMM-119-01-T-D | CONN HEADER 38POS DUAL 2MM T/H | datasheet.pdf | |
![]() | STB6N52K3 | MOSFET N-CH 525V 5A D2PAK | datasheet.pdf | |
![]() | DRTR5V0U1LP-7B | TVS DIODE 5.5VWM 10VC DFN10062 | datasheet.pdf | |
![]() | 13008-080KESZ/HR | CAP TANT 10UF 63V 10% 2917 | datasheet.pdf | |
![]() | 5SGXEB9R3H43I4N | IC FPGA 600 I/O 1760HBGA | datasheet.pdf | |
![]() | EP60WV031 | HOOF W/DENT 3.10MM (0.122) | datasheet.pdf | |
![]() | 09552663822741 | D-Sub Connector Plug, Male Pins 15 Position Surface Mount, Right Angle Solder | datasheet.pdf | |
![]() | ATS-15B-33-C3-R0 | HEATSINK 57.9X36.83X17.78MM T412 | datasheet.pdf | |
![]() | ATS-18E-08-C3-R0 | HEATSINK 45X45X15MM XCUT T412 | datasheet.pdf | |
![]() | D-406-0003CS2868 | INSULATION SLEEVE | datasheet.pdf |