Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-88911-101LF | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Assembly/Origin | Multiple Devices Location Change 29/Jan/2015 | |
PCN Other | Multiple Devices Material 25/Nov/2014 Multiple Devices Material Reversal 22/Apr/2015 | |
Standard Package | 1,000 | |
Category | Connectors, Interconnects | |
Family | Backplane Connectors - Housings | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 88911-101LF | |
Related Links | 88911, 88911-101LF Datasheet, FFF Distributor |
![]() | PI3B33X257B | IC MUX/DEMUX QUAD 1X2 48BQSOP | datasheet.pdf | |
![]() | GMM36DRXS | CONN EDGECARD 72POS DIP .156 SLD | datasheet.pdf | |
![]() | 147072-1 | CONN PC PIN SQUARE 0.045 GOLD | datasheet.pdf | |
![]() | SI7945DP-T1-GE3 | MOSFET 2P-CH 30V 7A PPAK SO-8 | datasheet.pdf | |
![]() | HF30ACB201209-T | FERRITE CHIP 7 OHM 600MA 0805 | datasheet.pdf | |
![]() | VI-J4M-MZ-F2 | CONVERTER MOD DC/DC 10V 25W | datasheet.pdf | |
![]() | 1MIC 3M662XW DLF 3MIL TH 4.25 IN | LAPPING FILM DIAMOND 4.25" DIA | datasheet.pdf | |
![]() | 3156U00490004 | LOW HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | DIN-032RPA-DPW1-HM | CONN PLUG DIN 32POS VERT GOLD | datasheet.pdf | |
![]() | 1043320000 | CONN TERM BLOCK R/A 3POS 7.62MM | datasheet.pdf | |
![]() | L177DFDG50S1AMNRM6 | D-Sub Connector Receptacle, Female Sockets 50 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | XCZU7EV-1FBVB900I | Microprocessor Circuit, CMOS, PBGA900 IC | datasheet.pdf |