Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-929715-03-03-I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Male Pins | |
Series | 929 | |
Packaging | Bulk | |
Contact Type | Male Pin | |
Connector Type | Header, Unshrouded | |
Number of Positions | 6 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 2 | |
Row Spacing | 0.100" (2.54mm) | |
Contact Mating Length | 0.318" (8.08mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Fastening Type | - | |
Features | - | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 929715-03-03-I | |
Related Links | 929715-, 929715-03-03-I Datasheet, 3M Distributor |
![]() | AD9248BSTZ-40 | IC ADC 14BIT DUAL 40MSPS 64-LQFP | datasheet.pdf | |
![]() | HSTTVA25-48-Q | HEAT SHRINK POLY W/ADH 1/4 "X 4' | datasheet.pdf | |
![]() | RCM06DRSN | CONN EDGECARD 12POS DIP .156 SLD | datasheet.pdf | |
![]() | 6399B-P2G | BOARD LEVEL HEAT SINK | datasheet.pdf | |
![]() | STW13NM50N | MOSFET N-CH 500V 12A TO-247 | datasheet.pdf | |
![]() | 1614973-1 | RES SMD 8.25K OHM 0.1% 1/8W 1206 | datasheet.pdf | |
![]() | CR0402-FX-2321GLF | RES SMD 2.32K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | 485SD9RJ | 9PIN 232/485 CONV W/SD & RJ11 | datasheet.pdf | |
![]() | Y162436R5000B9W | RES SMD 36.5 OHM 0.1% 1/5W 0805 | datasheet.pdf | |
![]() | PCM-E | CARD MARKER WIRE SOLID | datasheet.pdf | |
![]() | ATS-12H-10-C3-R0 | HEATSINK 45X45X25MM XCUT T412 | datasheet.pdf | |
![]() | UTM1H3R3MED1TD | CAP ALUM 3.3UF 20% 50V RADIAL | datasheet.pdf |