Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-929834-03-18-RK | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Male Pins | |
Series | 929 | |
Packaging | Bulk | |
Contact Type | Male Pin | |
Connector Type | Header, Unshrouded, Breakaway | |
Number of Positions | 18 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 1 | |
Row Spacing | - | |
Contact Mating Length | 0.235" (5.97mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Fastening Type | - | |
Features | - | |
Contact Finish | Tin | |
Contact Finish Thickness | 200µin (5.08µm) | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 929834-03-18-RK | |
Related Links | 929834-, 929834-03-18-RK Datasheet, 3M Distributor |
![]() | SSQ-128-02-S-D | Connector Receptacle 56 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 929984-01-16 | Connector Receptacle 16 Position 0.100" (2.54mm) Tin-Lead Through Hole | datasheet.pdf | |
![]() | HSC31DRTI-S93 | CONN EDGECARD 62POS DIP .100 SLD | datasheet.pdf | |
![]() | XC2VP70-5FFG1704C | IC FPGA 996 I/O 1704FCBGA | datasheet.pdf | |
![]() | 4-647477-2 | 12P MTA100 CONN ASSY F/T LF | datasheet.pdf | |
![]() | 3100U00031761 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | 005150659905 | ROUND SPACER #2 ACETAL 3MM | datasheet.pdf | |
![]() | 8N3QV01EG-0085CDI | IC OSC VCXO QD FREQ 10CLCC | datasheet.pdf | |
![]() | 79258-434HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | ATS-06F-10-C1-R0 | HEATSINK 45X45X25MM XCUT | datasheet.pdf | |
SI5340B-B-GM | IC CLK BUFFER PLL 44QFN | datasheet.pdf | ||
![]() | AH3772-SA-7 | HALL LATCH SWITCH SOT23 | datasheet.pdf |