Laird Technologies - Engineered Thermal Solutions A10104-01
- Mfg. Part Number
- A10104-01
- Manufacturer
- Laird Technologies - Engineered Thermal Solutions
- Product Category
- Thermal - Pads, Sheets
- Brief Description
- TPLI 2120 A0 8" X 8"
- Datasheet Download
- A10104-01.pdf
Availability of A10104-01
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 166.45500
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of A10104-01, we specialize in Laird Technologies - Engineered Thermal Solutions all series electronic components. A10104-01 can be shipped within 24 hours after order. If you have any demands for A10104-01, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- A10104-01 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
A10104-01
| Internal Part Number | EIS-A10104-01 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tpli™ 200 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 203.20mm x 203.20mm | |
| Thickness | 0.120" (3.05mm) | |
| Material | Silicone Elastomer | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 6.0 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A10104-01 | |
| Related Links | A101, A10104-01 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
A10104-01 Details Description
Related parts for A10104-01
| 766161101G | RES ARRAY 15 RES 100 OHM 16SOIC | datasheet.pdf | |
| XCV200-5BG352I | IC FPGA 260 I/O 352MBGA | datasheet.pdf | |
| 3-643816-9 | CONN RECEPT 9POS 28AWG MTA100 | datasheet.pdf | |
 | PIC24HJ32GP302T-I/SO | IC MCU 16BIT 32KB FLASH 28SOIC | datasheet.pdf | |
 | X9259US24IZ-2.7 | IC XDCP QUAD 256TP 50K 24-SOIC | datasheet.pdf | |
 | ADS1146EVM-PDK | KIT PERFORMANCE DEMO FOR ADS1146 | datasheet.pdf | |
| UPGN111-25412-1 | CIRCUIT BREAKER MAG-HYDR TOGGLE | datasheet.pdf | |
| 2727R-09F | FIXED IND 47UH 200MA 4.7 OHM TH | datasheet.pdf | |
| 10091777-S0E-40B | XCEDE RIGHT 4PVH 8COL | datasheet.pdf | |
| 09473636005 | RJI CORDPP OVERMPCR2XRJ45 22/1 | datasheet.pdf | |
| ATS-P2-45-C2-R0 | HEATSINK 25X25X20MM L-TAB T766 | datasheet.pdf | |
 | 67L115-0286 | THERMOSTAT 115 DEG NC TO-220 | datasheet.pdf |