Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A15332-01 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 300 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 228.60mm x 228.60mm | |
| Thickness | 0.120" (3.05mm) | |
| Material | Silicone Elastomer | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Green | |
| Thermal Resistivity | 2.11°C/W | |
| Thermal Conductivity | 1.2 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A15332-01 | |
| Related Links | A153, A15332-01 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | MCHC908JW32FAE | IC MCU 8BIT 32KB FLASH 48LQFP | datasheet.pdf | |
![]() | AYM22DTMH-S189 | CONN EDGECARD 44POS R/A .156 SLD | datasheet.pdf | |
![]() | TCM320 | MODULE SOC RF TXRX W/8051 MCU | datasheet.pdf | |
![]() | RN55E3322CR36 | RES 33.2K OHM 1/8W .25% AXIAL | datasheet.pdf | |
![]() | RCH664NP-100M | FIXED IND 10UH 1.75A 56.6 MOHM | datasheet.pdf | |
![]() | 8N3QV01LG-0058CDI8 | IC OSC VCXO QD FREQ 10CLCC | datasheet.pdf | |
![]() | 68449-101HLF | HEADER BERGSTIK | datasheet.pdf | |
| 1N5624-TAP | DIODE AVALANCHE 200V 3A SOD64 | datasheet.pdf | ||
![]() | 20020009-D221B01LF | TERM BLOCK | datasheet.pdf | |
![]() | 179463-6 | CONN POWER DBL LOCK RCPT HSG 2P | datasheet.pdf | |
| IS46R16160F-5TLA1-TR | IC DDR1 256MB 2.5V 200MHZ 66TSOP | datasheet.pdf | ||
![]() | R5F21255SNFP#X6 | IC MCU 16BIT 24KB FLASH 52LQFP | datasheet.pdf |