Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A16364-06 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ XS400 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 457.20mm x 457.20mm | |
| Thickness | 0.060" (1.52mm) | |
| Material | Elastomer | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | Liner | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 2.0 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A16364-06 | |
| Related Links | A163, A16364-06 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
| IRFB9N65APBF | MOSFET N-CH 650V 8.5A TO-220AB | datasheet.pdf | ||
![]() | LLM215R71C683MA11L | CAP CER 0.068UF 16V X7R 0805 | datasheet.pdf | |
![]() | MP9100-20.0-1% | RES 20 OHM 100W 1% TO247 | datasheet.pdf | |
![]() | DPPM12S12K-F | CAP FILM 0.012UF 10% 1.2KVDC RAD | datasheet.pdf | |
![]() | NX3L1T3157GM,132 | IC SWITCH SPDT 6XSON | datasheet.pdf | |
![]() | SSTVA16859AG | IC BUFFER DDR 13-26BIT 64-TSSOP | datasheet.pdf | |
![]() | SBH51-LPSE-D49-ST-BK | CONN HEADER 98POS 1MM GOLD VERT | datasheet.pdf | |
![]() | RER50F2611PC02 | RES CHAS MNT 2.61K OHM 1% 20W | datasheet.pdf | |
![]() | 61500161155 | SURFACE LS BELT 2X17-3/4" A CRS | datasheet.pdf | |
![]() | Y00621K30000T9L | RES 1.3K OHM 0.6W 0.01% RADIAL | datasheet.pdf | |
![]() | MKP1848C64560JP5 | CAP FILM 45UF 5% 600VDC RADIAL | datasheet.pdf | |
![]() | SIT9002AI-18H33ED | OSC MEMS PROG | datasheet.pdf |