Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A2F500M3G-PQ208 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion® | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | Ethernet, I²C, SPI, UART/USART | |
| Speed | 80MHz | |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 208-BFQFP | |
| Supplier Device Package | 208-PQFP (28x28) | |
| Number of I/O | MCU - 22, FPGA - 66 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A2F500M3G-PQ208 | |
| Related Links | A2F500M, A2F500M3G-PQ208 Datasheet, Microsemi SoC Distributor | |
| 364002-D01 | CORD 3COND M/F EURO UNSHLD 2.5M | datasheet.pdf | ||
![]() | QT115-D | SENSOR IC TOUCH/PROXMTY 1CH 8DIP | datasheet.pdf | |
![]() | 118293016001012 | CONN PLUG IDC W/RELIEF 16POS | datasheet.pdf | |
![]() | 71016S15YGI | IC SRAM 1MBIT 15NS 44SOJ | datasheet.pdf | |
![]() | MK74CB218BR | IC CLK BUFFER 1:8 200MHZ 28QSOP | datasheet.pdf | |
![]() | G70D-SOC16 DC24 | RELAY 16POS 24V BLOCK NPN | datasheet.pdf | |
![]() | 744771239 | FIXED IND 390UH 680MA 690 MOHM | datasheet.pdf | |
![]() | XPEBWT-U1-R250-007F8 | LED XLAMP WARM WHITE 2850K 2SMD | datasheet.pdf | |
![]() | GT8Z-24DS-2C | CONN 24CONT SOCKET | datasheet.pdf | |
![]() | P9165-00NQGI | IC PMIC PWR MGMT MULTI-CH 84QFN | datasheet.pdf | |
![]() | ATS-16D-208-C3-R0 | HEATSINK 70X70X6MM XCUT T412 | datasheet.pdf | |
![]() | PLA17BK5 | PREM 3D FLMNT BLACK | datasheet.pdf |