Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P1000-2FG484M | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 300 | |
| Number of Gates | 1000000 | |
| Voltage - Supply | 1.14 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -55°C ~ 125°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P1000-2FG484M | |
| Related Links | A3P1000, A3P1000-2FG484M Datasheet, Microsemi SoC Distributor | |
![]() | ERO-S2PHF9R10 | RES 9.1 OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | XC2V3000-5FGG676C | IC FPGA 484 I/O 676FBGA | datasheet.pdf | |
![]() | NCV4279D1 | IC REG LDO 5V 8SOIC | datasheet.pdf | |
![]() | MA330019 | PIM DSPIC33F MC 44P-100P QFN | datasheet.pdf | |
![]() | VI-27L-EX-B1 | CONVERTER MOD DC/DC 28V 75W | datasheet.pdf | |
![]() | RER60F1001RCSL | RES CHAS MNT 1K OHM 1% 5W | datasheet.pdf | |
![]() | M55342H03B93B1RWS | RES SMD 93.1K OHM 0.1% 1/5W 1005 | datasheet.pdf | |
![]() | Y16244K99000B9W | RES SMD 4.99K OHM 0.1% 1/5W 0805 | datasheet.pdf | |
![]() | U.FL-LP-068N2-A-(150) | SINGLE ENDED CABLE ASSEMBLY | datasheet.pdf | |
![]() | ATS-19D-120-C3-R0 | HEATSINK 45X45X25MM XCUT T412 | datasheet.pdf | |
![]() | 600220-15 | MW35-C HY 20AWG 15KG/33LBS | datasheet.pdf | |
![]() | OQ10548100J0G | 508 TB SOCKET CLOSE RA | datasheet.pdf |